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How To Calculate The Thickness Of Silicon Wafers?

  • wafernet01
  • Mar 8, 2016
  • 2 min read

Silicon wafers are available in a variety of diameters from 1 inch to 17.72 inches. Fabrication plants of semiconductors are defined by the diameter of wafers that they produce. The diameter steadily improves output and reduces costs with the current state of the fabrication.


Silicon wafer thickness is determined by the mechanical power of the material used. The wafer must be solid enough to bear its own weight without developing any cracks. .


The 100mm silicon wafers fabrication steps can be performed on more pieces of wafers as roughly to increase the wafer diameter. The cost of each fabrication step goes up more gradually than the square of the wafer diameter.


Different methods to calculate the thickness of the wafers:


Die Per Wafer Calculator: In this method, a specialized calculator is used which uses the various inputs such as wafer die size, diameter, die spacing, and edge exclusion to calculate the whole thickness of the wafer.

Crystalline Orientation Flats and Orientation Notches: Silicon wafers under 100mm diameter have flat cuts into one or more side representing the crystallographic planes of the wafer. Earlier the wafers had a pair of flats at different angles which indicate the doping type.


Silicon Wafer Crystallographic Orientation Flats: In this method, one or two flats ground in the edge of the silicon wafer specifies crystal orientation. Flats are used to signify doping and crystallographic orientation.


Wafer Orientation Notches and Flats: Wafers are made from crystals having a normal crystal structure with silicon having a diamond cubic structure. The wafer when cut into small chips, the surface is allied with one of the relative directions known as crystal orientations. Orientation is important because the single crystal structure and electronic properties are highly anisotropic. Wafer cleavage usually occurs in defined directions. The wafers placed along the cleavage plane allows it to be easily diced into individual chips.

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